Gartner further down the chip equipment maker is expected to chip into a panic

According to EE Times website reported that market research firm Gartner recently revised expectations for semiconductor equipment spending, Gartner expects the semiconductor equipment spending in 2008 decreased 30.6% in 2009, will further decrease of 31.7%.

Gartner pointed out that supply-side issues of recession and SN74HC00DR datasheet and the semiconductor manufacturers in the first half of 2009 into a "panic state", more substantial reduction in capital expenditure.

10 Yue , Gartner expects the chip will be reduced by 25.2% in capital spending in 2009 decreased by 12.8%.

Recently, SEMI reported that wafer fab equipment market has shrunk the third quarter, a serious, global shipments amounted to $ 6,560,000,000, 16% less than the second quarter, less than 41% of the third quarter last year. iSuppli recently lowered its 2008 and SN74HC00DR price and 2009 semiconductor industry revenue.

Revised report based on the latest Gartner, 2008 and SN74HC00DR suppliers and 2009, worldwide semiconductor equipment revenues were 31.1 billion U.S. dollars and 212 billion dollars.

Gartner vice president of semiconductor manufacturing Klaus Rinnen said in a statement, the economic downturn in the semiconductor and equipment industry is very vulnerable when attacked.

"Device manufacturers in all areas, including NAND and DRAM industry have begun to take measures to cut production and close factories in lower cost efficiency." Rinnen said, "We see fab project delayed capital spending, most of concerned about the new technology. "

Gartner now expects wafer fab equipment spending in 2008 will be reduced by 30.9%, 33.1% in 2009 will be reduced. Lithography equipment spending in 2008 will be reduced by 22%, 193nm immersion technology will replace more widely than the older technology. Lithography equipment spending in 2009 will be further reduced by 38% due to memory manufacturers using immersion technology slowdown the pace of applications for extension of the old equipment.

The report also noted that in 2008 and 2009 are the global packaging equipment spending will decline about 30%. 2008, automatic test equipment market will shrink by 30% will shrink 20% in 2009, when the test equipment sales will drop to $ 2,000,000,000 or less.

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