Electronic information
Mobile devices: 3G demand is hot
In Electronic Infomation Category: R | on November 1, 2010
The past two years, cell phone modules and MAX232CWE datasheet and discrete components with a comprehensive development, technological innovation, Zhuo
effective, especially in 3G chips increase data processing speed, enhanced multimedia capabilities, the development
multi-mode function, improve integration, etc. significant progress in both areas, so that high-speed 3G mobile data transmission and MAX232CWE price and mobile multimedia
transfer functions become more perfect.
Amplifier module
GSM tri-band amplifier module Si4300T, integrated power amplifier, power control,
protection circuit, filter and MAX232CWE suppliers and matching circuit, a volume of 3.9mm × 6.4mm × 1.3mm ,
one of the early adopters of the CMOS power amplifier technology. Typical WCDMA power amplifier module products
products, such as for 1920MHz ~ 1980MHz band power amplifier module, the maximum efficiency can be
42%, external dimensions of 3mm × 3mm × 0.9mm; for UMTS 2100MHz band
amplifier module, the output power of +28.5 dBm, the maximum efficiency of up to 45%, external dimensions
4mm × 4mm × 1.1mm.
Phone RF front-end RF module
some have a single chip can be integrated, or integrated with a single baseband chip,
but in the RF front end, and power amplifier module, double SAW filters and other working devices and components. In order to simplify handset design and reduce
mounting area, often made by LTCC technology RF front-end modules.
Representative product in support of HSDPA, WCDMA mobile phone front-end module, the product
5mm × 8mm × 1.2mm package integrates a power amplifier, duplexer, power detector and filter
filter , compared with the use of discrete components, reducing the mounting area of about 50%. Front-end CDMA phone
modules, external dimensions of 4mm × 7mm × 1.2mm.
CMOS RF switch
RF switches for mobile phones, usually with GaAs manufacturing, in recent years the development of CMOS RF
switch, and GaAs can provide the same performance, operating frequency up to 3GHz band. PE4261 is
- kinds of single-chip dual-band GSM with a four-throw (SP4T) switch, PE4263 is a quad-band GSM
with the single six-throw (SP6T) switch, insertion loss and isolation indicators are as follows: 900MHz were 0.55dB and when
45dB, 1.9GHz and 0.65dB respectively at 40dB, the maximum switching time
3ns.
SAW and BAW
Murata SAW devices developed in recent years several foreign countries on behalf of the current level. SAFEB
series of SAW filters external dimensions of 1.35mm × 1.05mm × 0.6mm, the product than the original
be reduced by 44%, weight of 3mg, the series in the 800MHz to 2GMHz all
working frequency of mobile communication system has a corresponding specification. Double SAW filter series
SAWEP the external dimensions of 2.0mm × 1.6mm × 0.6mm, the installation space than the original product
decreased 64%, weight of 6mg. Muratas new product CDMA800 SAW duplexer, receive,
made channels were 3.3dB insertion loss and 2.1dB, respectively, 45dB isolation and 57dB.
For IMT-20001.7GMHz the SAW duplexer external dimensions 3.0mm × 2.5mm × 0.8mm,
has a low insertion loss and high isolation. These products can be used solder, reflow soldering temperature peak
up to 260 ℃.
The SAW filter insertion loss greater than 2GHz, BAW (Bulk Acoustic Wave) filter at 10GHz due to above and available
attention. BAW filter has better performance than SAW filters and filter media
, can reduce the insertion loss and overall dimensions, although currently not yet widely used in mobile phones,
but in the 2GHz frequency band should be better than application.
MLCC
MLCC direction of development is still the medium by making thinner multi-layer film and the use of advanced
technology to further reduce the dimensions and increased capacity. In the past, the distance between the electrodes limits
about 1μm, TDK has developed the fine particle size of 0.2μm powder material in order to achieve the
electrode spacing in the thin film multi-layer structure below 1μm, can greatly increase the ratio of capacity to 1.6mm
× 0.8mm specifications, for example, capacity increased from 4.7μF 10μF. Open
also issued a 0.4mm × 0.2mm size of the product, we are developing electrode gap is 0.5μm, stacked layers of more than 1,000
layer film product.
The past 10 years, Murata MLCC dielectric thickness will be reduced to 1μm from the following 4μm,
layer laminated layer from 200 to 1,400 level, specific volume increased significantly. Available from multiple vendors can provide 100μF
the MLCC.
Ultra-small chip inductors
Muratas LQW04A series of ultra-small high-frequency wirewound chip inductors, inductance is 1.1nH ~ 22nH range
, Dimension (EIA03015) is 0.8mm × 0.4mm × 0.
4mm, installation area than a 40% reduction EIA0402 highly reduced 0.4mm. Another kind of ultra-small film
chip inductors, inductance range of 0.4nH ~ 10nH, foot shape
inch (01005EIA) is 0.4mm × 0.2mm × 0.2mm, mounting area than the 0201
EIA 40% reduction. The two chip inductors with good high frequency characteristics.
effective, especially in 3G chips increase data processing speed, enhanced multimedia capabilities, the development
multi-mode function, improve integration, etc. significant progress in both areas, so that high-speed 3G mobile data transmission and MAX232CWE price and mobile multimedia
transfer functions become more perfect.
Amplifier module
GSM tri-band amplifier module Si4300T, integrated power amplifier, power control,
protection circuit, filter and MAX232CWE suppliers and matching circuit, a volume of 3.9mm × 6.4mm × 1.3mm ,
one of the early adopters of the CMOS power amplifier technology. Typical WCDMA power amplifier module products
products, such as for 1920MHz ~ 1980MHz band power amplifier module, the maximum efficiency can be
42%, external dimensions of 3mm × 3mm × 0.9mm; for UMTS 2100MHz band
amplifier module, the output power of +28.5 dBm, the maximum efficiency of up to 45%, external dimensions
4mm × 4mm × 1.1mm.
Phone RF front-end RF module
some have a single chip can be integrated, or integrated with a single baseband chip,
but in the RF front end, and power amplifier module, double SAW filters and other working devices and components. In order to simplify handset design and reduce
mounting area, often made by LTCC technology RF front-end modules.
Representative product in support of HSDPA, WCDMA mobile phone front-end module, the product
5mm × 8mm × 1.2mm package integrates a power amplifier, duplexer, power detector and filter
filter , compared with the use of discrete components, reducing the mounting area of about 50%. Front-end CDMA phone
modules, external dimensions of 4mm × 7mm × 1.2mm.
CMOS RF switch
RF switches for mobile phones, usually with GaAs manufacturing, in recent years the development of CMOS RF
switch, and GaAs can provide the same performance, operating frequency up to 3GHz band. PE4261 is
- kinds of single-chip dual-band GSM with a four-throw (SP4T) switch, PE4263 is a quad-band GSM
with the single six-throw (SP6T) switch, insertion loss and isolation indicators are as follows: 900MHz were 0.55dB and when
45dB, 1.9GHz and 0.65dB respectively at 40dB, the maximum switching time
3ns.
SAW and BAW
Murata SAW devices developed in recent years several foreign countries on behalf of the current level. SAFEB
series of SAW filters external dimensions of 1.35mm × 1.05mm × 0.6mm, the product than the original
be reduced by 44%, weight of 3mg, the series in the 800MHz to 2GMHz all
working frequency of mobile communication system has a corresponding specification. Double SAW filter series
SAWEP the external dimensions of 2.0mm × 1.6mm × 0.6mm, the installation space than the original product
decreased 64%, weight of 6mg. Muratas new product CDMA800 SAW duplexer, receive,
made channels were 3.3dB insertion loss and 2.1dB, respectively, 45dB isolation and 57dB.
For IMT-20001.7GMHz the SAW duplexer external dimensions 3.0mm × 2.5mm × 0.8mm,
has a low insertion loss and high isolation. These products can be used solder, reflow soldering temperature peak
up to 260 ℃.
The SAW filter insertion loss greater than 2GHz, BAW (Bulk Acoustic Wave) filter at 10GHz due to above and available
attention. BAW filter has better performance than SAW filters and filter media
, can reduce the insertion loss and overall dimensions, although currently not yet widely used in mobile phones,
but in the 2GHz frequency band should be better than application.
MLCC
MLCC direction of development is still the medium by making thinner multi-layer film and the use of advanced
technology to further reduce the dimensions and increased capacity. In the past, the distance between the electrodes limits
about 1μm, TDK has developed the fine particle size of 0.2μm powder material in order to achieve the
electrode spacing in the thin film multi-layer structure below 1μm, can greatly increase the ratio of capacity to 1.6mm
× 0.8mm specifications, for example, capacity increased from 4.7μF 10μF. Open
also issued a 0.4mm × 0.2mm size of the product, we are developing electrode gap is 0.5μm, stacked layers of more than 1,000
layer film product.
The past 10 years, Murata MLCC dielectric thickness will be reduced to 1μm from the following 4μm,
layer laminated layer from 200 to 1,400 level, specific volume increased significantly. Available from multiple vendors can provide 100μF
the MLCC.
Ultra-small chip inductors
Muratas LQW04A series of ultra-small high-frequency wirewound chip inductors, inductance is 1.1nH ~ 22nH range
, Dimension (EIA03015) is 0.8mm × 0.4mm × 0.
4mm, installation area than a 40% reduction EIA0402 highly reduced 0.4mm. Another kind of ultra-small film
chip inductors, inductance range of 0.4nH ~ 10nH, foot shape
inch (01005EIA) is 0.4mm × 0.2mm × 0.2mm, mounting area than the 0201
EIA 40% reduction. The two chip inductors with good high frequency characteristics.