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Achieve 200Mbps of RF chips come draft IEEE802.11n

In Electronic Infomation Category: R | on December   1, 2010

Industry-leading VDSL chipset designer with Israel Metalink has successfully developed in line with the company is currently developing high-speed wireless LAN standard IEE The product has a 2 on the transceiver circuit, the use of spatial multiplexing MIMO (Multiple Input Multiple Output), for the first time in the physical layer over 200Mbit / sec transfer rate. Following the FTTH and GAL22V10D-15LJ datasheet and VDSL, the wish to provide the final 10m of the broadband environment, the company has been involved in high-speed wireless LAN market, plans volume production in Q3 2005 MtW8150. In addition to this the MtW8150, they also need the antenna interface as passive components group and GAL22V10D-15LJ price and the baseband chip to form transceiver modules. The use of CMOS technology development company is the baseband chip MtW8170, planned for 2005 Q3 began to supply samples.

This product with 2 sets of 20MHz channels at the same time, and GAL22V10D-15LJ suppliers and in the use of two transmitter at the receiver using three antennas, the physical layer transmission speed communication in a distance of 10m more than the maximum 200Mbit / sec. Sending and receiving ends of the use of two antennas, the data transfer just to 2 times. Even if the actual data transfer speed, also reportedly more than 150Mbit / sec. Not supported with Airgo Networks MIMO Channel bonding of the chip group, about twice as fast speed. Metalink said the real and the Airgo MIMO only two of its other wireless LAN vendor claims and a variety of beam forming functions are hardly antenna diversity MIMO. E802.11n draft standard RF chip MtW8150, samples are available now.

Tagged as: GAL22V10D-15LJ datasheet IC GAL22V10D-15LJ suppliers GAL22V10D-15LJ Price

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