TI precision operational amplifier 4 4mm DFN Package

Texas Instruments Inc. (TI) announced a company from its Burr-Brown product line, using the new 4 × 4mm DFN package of high Precision Amplifiers - OPA277. Which no-lead chip scale package standard (near-chip-scale package) thickness less than 1mm, in contact with both sides using only way to achieve a minimum of board space, and EP1K10TC144-3 datasheet and through the exposed die pad greatly enhanced heat dissipation characteristics. Using standard PCB assembly techniques, easy to mount DFN package. OPA277

smaller package size allows designers to achieve a variety of applications in the following more compact design, these applications include industrial electronics, temperature measurement, battery-powered instruments and EP1K10TC144-3 price and test equipment. In addition, due to the heat through the exposed pad is easy to be consumed, in a stable, low chip temperatures, OPA277 small package size helps to achieve sustained high-precision work. OPA277 has extremely low offset voltage (typically 35uV) and EP1K10TC144-3 suppliers and drift, low bias current, high common mode rejection, and high power supply rejection and other characteristics. The device also offers high open-loop gain and wide supply voltage range (± 18V).

OPA277 (single) and OPA2277 (dual channel) are used 4 × 4mm DFN package. 1,000-piece quantities, single and dual-channel version of the suggested retail price was $ 0.85 and $ 0.65 (for reference). Both devices are available now through TI and its currently authorized distributors.