Electronic information
Infineons 300mm semiconductor plant groundbreaking
In Electronic Infomation Category: R | on April 27, 2011
Recently, Infineons 300mm semiconductor factory in Germany broke ground on the plants total investment in the next three years up to 11 billion euros. Full name of the new semiconductor plant called Infineon Technologies SC300 GmbH & Co. KG. Civil works will be completed next spring, the second half of production. 300mm
new product line will be installed next spring. After the new plant, the first 300mm off the assembly line of new products will be the end of 2001, when it will produce 0.14-micron process 256MB memory products, to 2002, will be able to produce 0.11 micron 512MB of memory.
300mm chip technology will significantly reduce production costs. 300mm silicon wafer can accommodate the number of chips on a 200mm 2.5 times.