SiGe semiconductor front-end Wi-Fi / Bluetooth module provides highly integrated solutions

SiGe Semiconductor (SiGe Semiconductor, Inc) has expanded its Wi-Fi product line, launched SE2571U front-end module, specifically aimed at mobile phones, games, digital cameras and IR6311G datasheet and personal media players (PMP) for embedded applications. SE2571U response to OEM manufacturers for the specific challenges facing the design, characterized by including the realization of "battery direct power supply" operation, improve performance and IR6311G price and meet consumer demand for portable devices built-in Universal Mobile Telecommunications System (UMTS) connectivity needs.

SE2571U provides a complete RF transmit 2.4 GHz WLAN and IR6311G suppliers and Bluetooth access solutions available from the output of the transceiver to the antenna and sent to the transceiver from the antenna input. In addition, the device integrates a high performance power amplifier, a bypass mode, low noise amplifier, power detector, harmonic filters, 2170 MHz notch filter (notch filter) and a SP3T switch, and configured to achieve Wi-Fi receiver, Wi-Fi and Bluetooth transmission RX / TX switch between. SE2571U available in 802.11b mode, 20dBm power; in 802.11g mode, 19dBm linear power to provide comprehensive, it is directly applicable to battery powered applications, the voltage range of 2.7V to 4.8V, can be avoided no power adjustment. The integrated filter to ensure that the transmission path compatible unnecessary spurious (spurious emission) emission, and in the cellular signal in the receive path to provide co-exist on the (co-existence) operation.

SiGe Semiconductor WiMAX and embedded WLAN Sanjiv Shah, director of product marketing, said: "We are very pleased to launch SE2571U front-end modules to the fast growing embedded Wi-Fi market. The new front-end module (FEM) comply with the OEM manufacturers and users for reliability, flexibility and performance needs, and can significantly reduce the list of equipment and materials (BOM) costs and circuit board assembly costs, and reducing overall system footprint for embedded applications which are extremely important. "

SE2571U RoHS-compliant lead-free, halogen-free 3 mm x 3 mm x 0.5 mm MSL 1 small package, this low-profile package make it suitable for integration in the WLAN module.

Pricing and Availability: Order 10000 SE2571U is priced at $ 0.82. SiGe company is now available for sampling, and application documents and evaluation with the board. SiGe Semiconductor provides prestigious customer support to help customers into the application of FEM into the design and optimize performance.