Universal 3MHz converter can improve the effectiveness of portable electronic devices

Analog Devices, Inc., The worlds leading high-performance signal processing solutions provider, recently introduced a battery-powered portable devices to optimize the energy efficiency of a new battery 3 MHz Step-Down DC-DC converters, expands its micro-switching regulator product line. With low input voltage, low quiescent current and MAX874CSA datasheet and the characteristics of small size, this 600 mA ADP2108 DC-DC converter offers designers more flexibility to meet the stringent power consumption and MAX874CSA price and PCB size of the budget, without increasing battery capacity, which is the design of small handheld devices such as mobile phones or portable inventory scanner, or rechargeable medical device, it is important to consider.

Efficient power conversion devices for extending the battery life is very important. 6MHz ADP2121 same family as the device, 3MHz ADP2108DC-DC converter input voltage as low as 2.3 V, can provide excellent conversion efficiency, transient response and MAX874CSA suppliers and protection. This low voltage allows designers to 2.5 V and 3 V power load fully before each charge the battery runs out of existing power, thus eliminating the need in some applications a more expensive step-up regulator. In light load conditions, ADP2108 switch to a low quiescent current mode to further conserve battery power consumption.

Save space and thermal management is also modular design of portable devices and POL (point of load ) system is a very important consideration. ADP2108 device requires only three tiny external 0603 size components, plus more than 93% conversion efficiency, enabling designers to a smaller space in support of a greater load. In addition, ADI offers the ADIsimPower (TM) regulator design tools and other power management tools available for download, easy to design high-efficiency DC-DC converter module, while reducing risk.

ADP2108 offers two package options. 1 mm x 1.5 mm x 0.6 mm WLCSP (wafer level chip scale package) provides ultra-low profile size, suitable for a strictly limited board space (especially the Z-axis) in portable devices such as mobile phones. Another 3 mm x 1 mm TSOT-23 (thin small outline transistor) package is easy to PCB assembly.