Chip miniaturization of electronic components of the main direction of technology development
Present, with research and MAX894LESA datasheet and production of traditional elements gradually matured, the electronic components industry is moving into new materials, new techniques and MAX894LESA price and new technology driven product updates upgrade and MAX894LESA suppliers and deepen the development of a new period of industry as a whole shown a piece of , miniaturization trend, and, as the overall development of electronic information industry, the development of the electronic components industry also proposed new requirements. P>
With microelectronic circuits, surface mount technology (SMT) in the adoption and continued development and improvement, light, thin and small as a measure of an important symbol of electronic machine products. In order to make electronic devices smaller, we must first consider the miniaturization of electronic components. Chip, miniaturization of electronic components is the main direction of development in recent years, To some extent, chip, miniaturization of electronic components has become a measure of the level of technological development is one important indicator of the United States, Europe, Japan and other developed countries, and Asia-Pacific, India and other developing countries and regions, all types of electronic components have a corresponding chip products. Among them, the chip capacitors, chip resistors, chip inductors three passive components, chip components accounting for about 85% of total production to 90%.
Piece of electronic components, while the rapid development of miniaturization are not only traditional element in the rapid miniaturization of chip components are rapidly smaller. The current chip RC-type component is the mainstream of 1005 (English is 0402), is moving in the direction of a smaller form factor development. For example, the volume is only 0.0045cm 3 in the temperature-compensated crystal oscillator (TCXO) and a volume of 0.325cm 3 of the chip relays, as well as the height of only 1.55mm DIP switches and other small devices have been developed. Size reduction involves a series of materials and process issues, which is the current components of a hot, new materials and cutting-edge technology has begun to be used in ultra-small devices into the process, such as ultra-small connectors, contacts the center distance can be done to 0.025 "(0.635mm).
2008 years, for the entire electronics and information industry is a special period, electronic components industry is also affected by the financial crisis in 2008, the first three quarters, or the electronic components industry achieved steady growth, but from fourth quarter, the industry situation rapidly reversed, many components business sales revenue, profit and so on down the situation. Into the first quarter of 2009, although some industry as a whole is still not seen better, but as "Chinas electronic information industry revitalization and restructuring plan" and the introduction of 4 trillion yuan investment in the State gradually put in place, 3G market to start, and appliances to the countryside driving, many components companies are optimistic about the second quarter of this year is forecast to be flat or increase performance, many industry analysts are optimistic about Chinas electronic components industry, we also believe that the electronic components industry through this financial turmoil will be the component industry Market outlook remains bright. P>