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New material and technology to promote the development of passive electronic components

In Electronic Infomation Category: R | on July   10, 2011

Tsinghua University, Department of Materials

Changjiang Scholar Professor Zhou Ji

With the new concepts, new theories, new materials, new technologies, the field of passive components are used, passive components has become a very active area of technology innovation.

Nearly half a century, the rapid development of information technology, changes in the process of human civilization, in large part due to the semiconductor device integration technology innovation. This phenomenon has been described as the famous Moores Law, that is, integration of semiconductor integrated circuits doubles every 18 months. In contrast, a large number of semiconductor devices other than the electronic components, passive components, we are collectively referred to as the development is relatively slow, and TLP521-4GB datasheet and constitute a bottleneck in the development of electronic technology.

With the new concepts, new theories, new materials, new technologies, the field of passive components are used, passive components has become a very active area of technology innovation.

Materials have been brought forth a new generation of passive integration

Recent years the low temperature co-fired ceramic (LTCC) to make possible the integration of passive components. LTCC technology is a set of interconnect, passive components and TLP521-4GB price and packaging in one of the multi-layer ceramic manufacturing technology. The basic principle is to multi-layer ceramic component technology and TLP521-4GB suppliers and multi-layer circuit graphics technology, the use of low temperature sintering ceramics and metal conductors within the following co-fired at 900 ℃, formed within the multilayer ceramic passive components and interconnect, made of modules of three-dimensional integrated device or multi-layer ceramic circuit. The technology for integrated passive electronic components and high-density system-level electronic packaging provides the ideal platform. LTCC technology involves a series of complex scientific and technical issues, and one of the key problems is the low-temperature co-fired ceramic material.

LTCC material is based on LTCC technology. One of the most important material is a low dielectric constant (ε in 10 or less) low-grade fever ceramics, while the need to overcome the current difficulties is to achieve performance series. Although reported in the literature are many kinds of low-k LTCC materials, but so far can be commercialized are basically two types of material: one is the glass system is of practical value Ca0-B203-Si02-based material system formula (CBS series), Ferro Corporation for the United States patent. Crystalline phase is characterized by precipitation directly from the glass, so the microstructure of materials with good uniformity. The main problem is, B3 + material increase in the dielectric loss will increase and reduce its mechanical properties, and Si4 + would increase the sintering temperature is increased, it is difficult to adjust to the system components to achieve serialization. The second category is the ceramic oxide particles and low-melting glass phase composite ceramic - glass composite material. DuPont and Germanys Heraeus LTCC ceramic material fall into this category. Performance of such systems can be further adjusted on the premise that lower the melting point glass phase, while DuPont and Heraeus company selected low-grade fever, Department of the glass is mainly glass and sodium borosilicate glass, which promote lower sintering temperature of the components of Na and B increase would result in the increase of dielectric loss. Visible, low dielectric LTCC materials constraints is the core issue series sintering temperature and dielectric properties of the contradiction between. Existing commercial composition of low dielectric constant LTCC materials are selected that can be tolerated in the performance of the lowest sintering temperature point, any efforts to materials, doped materials are the sintering temperature will lead to the improvement of the material can not meet the co-fired requirements. Only the base material side also has low dielectric constant, dielectric loss and a low sintering temperature, can withstand the introduction of more modified components to achieve the material properties (such as dielectric constant, thermal properties, mechanical properties, etc.) adjustment. Therefore, the search and has a low dielectric constant and dielectric loss and low sintering temperature of the base material is to achieve high performance serialized side of low key dielectric LTCC materials.

Recent years, we studied the system, developed by the Si-Al fluoride oxide-based materials, a new generation of LTCC-based parties. Not only through the introduction of fluoride to reduce the dielectric constant of the medium and dielectric loss, but more significantly reduces the sintering temperature. Modulated by fluoride, so that the base side by adding a variety of high melting point materials can still be achieved when the regulator temperature sintering, which has a wide space optimization and tailoring.

Extraordinary electromagnetic media continue to improve

Magnetic media is the basis of passive electronic components and the core part of the passive components of the major development largely due to the dielectric material of the improved and enhanced. However, after nearly a century of exploration, conventional dielectric materials can improve the space has become smaller and smaller. "Metamaterials" (metamaterials, also known as "metamaterials") refers to a large class of design structures with artificial and extraordinary physical properties of the material system. In recent years, the photon (electromagnetic wave) band gap theory, the proposed left-handed medium theory for the design of these new materials system provides a theoretical basis. Metamaterials are expected for the passive components and passive integrated to provide a breakthrough, with extraordinary physical properties of the media may become the basis for a new generation of electronic components. Some new type of metamaterial-based passive components, such as ultra-small filters, micro-antenna, non-wound inductors have been proposed. Expected by artificial structure designed to use less (1-2 species) materials usually require a variety of materials to achieve a variety of components to achieve functions, which will help to overcome the passive integration obstacles facing materials compatible. Meanwhile, the passive components for the structural units of the network is to achieve a variety of extraordinary physical characteristics of the current design.

Been confirmed the existence of the memristor

According to our current knowledge, the basic passive electronic components only 3 categories, namely, resistors, capacitors and inductors. In fact, passive circuit has 4 major basic variables, namely current, voltage, charge and magnetic flux. As early as 1971, the University of California, Berkeley, Cai Shaotang (LeonChua) proposed a Professor prediction: there should be a fourth element exists. In his paper "memristor: the missing circuit element" put forward a new type of passive components - memory resistor (the memristor) of the original theoretical framework, suggesting that the memory circuit has a natural ability. Memristor is a non-linear resistor with memory function. Changes by controlling the current can change the resistance, if the high resistance is defined as "1", low resistance is defined as "0", then the resistance can be achieved store data.

2008, the U.S. subsidiary of HP Labs, Information and Quantum Systems Laboratory in the UK "Nature" published a paper claiming that they had confirmed the fourth fundamental circuit element in the world --- Memristor device (Memristor) presence, and successfully designed a working physical model of a memristor. In this system, solid-state electronic and ionic transport in an applied bias voltage are coupled together. This finding may help explain the past 50 years in the electronic devices in the apparent anomalies observed in the hysteresis current - voltage behavior of many examples. Memristor devices most interesting feature is that it can remember the amount of charge flowing through it. The resistance depends on the number of charge through this device, which allows charge to flow in one direction, the resistance will increase; If we allow the charge to reverse flow, the resistance is reduced. Simply put, this device is the resistance at any one time is a function of time --- how much charge forward or backward through it.

Currently some technical ways to achieve by the memristor, but restricting the development of such new hardware, the main problem is the circuit design. There is no design model of a memristor circuit of which it is used. It was predicted that 5 years after the product may be put into commercial applications.

Memristor will likely be used to make non-volatile storage devices, which means that the type of PC (personal computer), more energy-efficient computers and a similar approach to the human brain, and contact information of the analog computers, and may even transistor can be achieved by significantly improving the function of the density, which will e-science major impact on the development process.

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