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TSA5055T Suppliers

Of 32nm technology in the copper metal CMP voids

In Electronic Infomation Category: O | on 2011/4/18 10:16:12

When the feature size decreases to 32nm technology src="http://www.dzsc.com/news/uploadfile/2009415111846196.jpg" width=431 border=0> Table 2 summarizes CMP voids to adjust the levelSRC="HTTP: T2%E8%A1%A82.jpg?width="435border=0" 200904 magazine image src="http://www.dzsc.com/news/uploadfile/2009415111846557.jpg" width=461 border=0> Experiment 2 results show that the high fill rate relative to the slow filling plating reagent reagents performance better. Compared with the first experiment, CMP cleaning process after the impact src="http://www.dzsc.com/news/uploadfile/2009415111846221.jpg" width=444 border=0> Conclusion Bright field and TSA5055T datasheet and defect detection of defects in the metal of the parameters of the rate changes are sensitive enough, making the light field in the defect detecti...
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